Terminal blocks are more than just a product family: they are the invisible backbone of industrial automation, in-device electronics and energy infrastructure. Heading into 2026, the agenda revolving around these small components includes some surprisingly big headlines: miniaturization, push-in/spring connection technologies that radically reduce installation and maintenance time, socket and modular structures, high current requirements from the data center and artificial intelligence, the EU’s Digital Product Passport (DPP) approach, and regulatory pressure from fluoro-chemicals such as PFAS… All impacting terminal block design and the supply chain at the same time.
This blog post aims to summarize in plain language the ‘why’ and ‘how’ of these themes that will define the world of terminal blocks in 2026. It’s not presentation language or catalog style; it’s a read for those looking for practical frameworks to keep in mind when stripping wires, inserting boards or preparing test protocols in the field.
First a simple diagnosis: The constraint is mostly inside. Panel and device volumes are not growing, but rather more functions are fitting into the same volume. This means narrower pitch, more poles, higher density. 3.5 mm and 3.81 mm pitch class solutions are the main actors in the ‘millimeter wars’ on the board. On the power side, classes like 7.5 and 10.16 mm are indispensable to manage the increased current and heat. This dual structure – density on the signal side and temperature on the power side – requires dividing the terminal block family into two wings within the same design language.
The push-in/spring connection continues to shine. It’s not just about speed; it’s about repeatability. If the screw is not torqued correctly or loosens during maintenance, performance that seems guaranteed in theory can deviate in practice. Push-in standardizes assembly by reducing operator dependency, while vibration resistance is a plus in most applications. This advantage becomes even more pronounced with the use of end lugs for thin-core conductors. No wonder push-in is the ‘default setting’ for panel manufacturers in 2026.
Pluggable and modular architecture, on the other hand, should not be mistaken for ‘quick-disconnect’ comfort. The real value comes during maintenance and commissioning.
in the accumulation of lost minutes. When used in conjunction with pre-wired harnesses, not only are service times reduced, so is human error. Test taps, on/off bridging channels and legible marking areas should be considered the ‘comfort package’ of a well-designed terminal block in 2026.
On the regulatory side, two topics are changing the game: Digital Product Passport (DPP) and PFAS restrictions. The DPP is not a ‘document’, but a data gateway that the product carries with it throughout its life, ranging from material composition to repair instructions. This brings data management discipline to the forefront in multi-part, multi-variant product families such as terminal blocks. On the PFAS front, the picture is more technical: Flame retardant recipes, coating chemistry, lubricants… Although some exceptions are being discussed, by 2026 many manufacturers will have concretized their plans to move to halogen-free and PFAS-free alternatives.
Standards are the third pillar charting the course to 2026. The 2025 edition of IEC 60947-7-1 updates the scope and test framework for terminal blocks. The latest version of UL 1059 expands the provisions for short-circuit withstand assessment. IEC 61373 (shock/vibration) on the rail side and the IEC 60068 series in industrial environmental testing are the bridge that connects the ‘on-paper’ promises of the product to the realities in the field. A product roadmap that remains alien to these topics, no matter how elegant it looks, will be quickly challenged in 2026.
The impact of the data center and artificial intelligence is often sidelined as ‘not our domain’. Yet 48 V in-rack power architectures, with their increasing currents and copper cross-sections, are directly relevant to terminal block design: low contact resistance, low temperature rise, cable management and service ergonomics are now part of system efficiency. Terminal block selection can indirectly affect uptime targets.
So what makes a ‘good’ terminal block in 2026? One: It combines mini pitch signaling solutions and high current power solutions in the same family in the same design language. Two: It offers push-in and/or spring connection as complementary options without contradicting the screw, because there is no one right answer for every scenario. Three: Increase speed of service with pluggable variants and reduce operator error with an ecosystem of bridging, testing and marking. Four: DPP-ready data schema makes material, traceability and compliance information accessible via QR/NFC. Five: Develops alternative recipes to PFAS/halogen constraints and aligns suppliers accordingly. Six: Pulls UL/IEC and – depending on the application – IEC 61373 test plans early in the product validation process.
Let’s not skip insulation coordination (IEC 60664-1). CTI value, degree of contamination, creepage/clearance calculations: These are not aesthetic preferences, they are reliability math. When you push tolerances to gain 0.1 mm on a PCB, you can sometimes put the whole design at risk. In 2026, miniaturization is inevitable, but it is impossible to get around the isolation rules.
Production and quality perspective: Without in-mold quality monitoring, in-line optical inspection and a well-defined testing regime (thermal cycling, salt fog, vibration/shock), the ‘premium’ claim is weak. The repeatable performance of mechanisms such as push-in depends as much on the ergonomics of assembly jigs as on spring stiffness and coating consistency across the supply chain. In short, good terminal block design alone is not enough; good terminal block manufacturing and verification is required.
Two practical suggestions under digitalization: (1) Full digital twin via EPLAN macros and data portal; data continuity from schematic to production. (2) Single product passport aligned with DPP data schema: material/REACH, carbon footprint, demountability and compliance references in one QR. This duo also simplifies after-sales documentation, giving confidence to maintenance teams.
A checklist instead of a conclusion: When preparing a terminal block strategy in 2026, ask these six questions. (1) Are mini pitch and high current families managed with the same design language and accessory ecosystem? (2) Are push-in/spring and screw solutions positioned in the product tree to complement each other? (3) Are service/replacement flows simplified with pluggable and pre-wired options? (4) Is the DPP-ready data structure and PFAS/halogen transition plan ready? (5) Have UL/IEC and, if necessary, IEC 61373 tests been brought forward in the verification schedule? (6) With EPLAN/digital twin and QR-based passport, are we leaving no ‘undocumented’ devices in the field?
Terminal blocks, small but critical. In 2026, the brands that make a difference will be those that can deliver speed, reliability and transparency in the same package. This is a matter of business discipline, not just a product roadmap.
– Source Notes –
Technical references in the text: IEC 60947-7-1:2025; UL 1059 Ed.6 (2024); IEC 61373 and IEC 60068 series; IEC 60664-1; EU ESPR/Digital Product Passport; PFAS restriction discussions; 2024-2025 reports on European data center demand.